R&D Engineer (Up to Manager)

Key Responsibilities: 1. Follow semiconductor package processes and procedures on the production line 2. Optimize PKG processes & materials (Mold, Laser, SBA, Saw, AVI/FVI) 3. Conduct DOE (Design of Experiments), perform data analysis 4. Troubleshoot issues and propose innovative solutions to improve yield 5. Prepare buy-off reports (e.g., MBO, LBO) for customer approval

1. Educational background: • Bachelor’s degree or higher in Science or Engineering 2. Experiences: • More than 3 years of experience as a Process Engineer or in a related field • Experience in statistical analysis tools such as JMP or Minitab • Experience in semiconductor packaging processes • Skilled in report preparation and customer communication 3. Skills: • Strong English communication skills (speaking, listening, writing) • Familiar with semiconductor PKG equipment and processes • Skilled in PKG machine recipe control. • Effective team collaboration, communication, and presentation skills. • Knowledge of basic production procedures and failure analysis. • Proficient in MS Office (Excel, Word, PowerPoint). • Capable of troubleshooting process issues. • Experience in failure analysis, RMA handling, and 8D reporting. 4. Other: • Willing to train and work abroad (Korea) for about 3 months

1. KPI bonus and 13th Salary bonus 2. Willing to train and work abroad (Korea) for about 3 months 3. Shuttle bus