Assembly Department Module Engineer

Role Overview

The Module Engineer is responsible for overseeing and improving high-volume manufacturing equipment and processes used in advanced integrated circuit production. The role involves performing precise testing, introducing process enhancements, and supporting technology transfers to maintain manufacturing excellence while achieving safety, quality, and cost objectives. This position contributes directly to device miniaturization and process innovation, strengthening Intel’s global manufacturing capabilities.

Business Group

Intel Corporation’s Assembly Engineering team focuses on advancing semiconductor manufacturing processes and developing new technologies. The team plays a key role in scaling high-volume production, driving innovation, and facilitating technology transfers across global manufacturing facilities. Joining this group means contributing to Intel’s mission of developing transformative technologies that improve lives worldwide.

Key Responsibilities

• Oversee essential manufacturing equipment and processes in high-volume production to support integrated circuit manufacturing and device miniaturization.

• Perform testing and measurements to monitor critical dimensions and control defect levels throughout the production line.

• Propose and implement process modifications to improve production methods and operational efficiency.

• Carry out equipment maintenance, troubleshooting, and repairs on relevant module components.

• Implement continuous improvement initiatives to enhance safety, quality, cost efficiency, productivity, defect control, and yield performance.

• Work closely with equipment vendors to troubleshoot technical problems and introduce significant process and equipment improvements.

• Design and optimize systems to prevent process excursions and detect inconsistencies in materials and manufacturing processes.

• Support technology transfer and audit programs to maintain consistent standards across global production sites.

• Manage equipment installation, conversion, and qualification during factory ramp-up activities, ensuring compliance with safety and quality requirements.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, Automation and Control, Electronics, Data Science, Materials Science and Engineering, Metallurgy, Chemical Engineering, or a related physical science or engineering field.

• At least 1–3 years of experience in semiconductor packaging, electronics manufacturing, or high-volume Surface Mount Technology (SMT) assembly.

• Strong spoken and written English communication skills.

• Practical understanding of Ball Grid Array (BGA) package assembly and SMT manufacturing processes.

• Experience in yield enhancement, quality engineering, and manufacturing troubleshooting.

• Familiarity with BGA packaging and SMT production techniques.

• Knowledge of FMEA, PFMEA, Control Plans, Statistical Process Control (SPC), and corrective and preventive action processes.

• Familiarity with data analysis, scripting, and programming tools such as JMP, SQL, Power BI, and Python.

• Strong analytical thinking, troubleshooting capabilities, and root-cause analysis skills.

• Ability to collaborate effectively with cross-functional engineering teams and manufacturing organizations.

Additional Preferred Qualifications

• Experience working with automated inspection systems and vision-based manufacturing equipment.

• Understanding of quality improvement methodologies, including Six Sigma, DMAIC, 8D, FMEA, and Statistical Process Control.

• Demonstrated experience leading yield improvement projects in semiconductor or electronics manufacturing.

Relevant Experience in One or More of the Following Areas

• Hands-on experience maintaining and supporting automated optical inspection (AOI) systems, visual inspection equipment, or automated manufacturing machinery.

• Practical experience maintaining, programming, and troubleshooting automated stencil printers, 3D Solder Paste Inspection (SPI) systems, multi-zone reflow ovens, and aqueous or chemical deflux cleaning modules.

• Process Metallurgy and Joint Reliability: Understanding of BGA package assembly, lead-free solder metallurgy (including SAC alloys and low-temperature bismuth), intermetallic compound (IMC) growth control, and package warpage caused by Coefficient of Thermal Expansion (CTE) mismatch.

• Hands-on experience with industrial imaging hardware and high-precision 2D/3D metrology systems.

• A proven track record of successful projects involving the development of automation scripts and applications to improve manufacturing processes, including process optimization and enhanced defect detection using image processing, machine learning, or artificial intelligence.

Join us in shaping the future of technology through meaningful contributions to global manufacturing operations. This role offers opportunities to drive innovation, collaborate across teams, and grow professionally.

• Competitive salary and comprehensive benefits package.

• 13th-month salary and quarterly/yearly performance bonuses.

• Employee stock plan.

• Enhanced healthcare insurance for employees and their families.

• Social, health, and unemployment insurance in accordance with Vietnamese labor regulations.

• Meal allowance and on-site cafeteria.

• Company shuttle bus services.

• Professional training and career development opportunities.

• Opportunities to participate in multinational projects.

• Modern working facilities and a professional working environment.

• Employee wellness programs and social activities.

• Annual salary reviews.