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New Product Introduction
Thẻ
Loại hình
Tại văn phòng
Mức lương
Lương thỏa thuận
Hạn tuyển
13/11/2026
Nội dung
- Develop and maintain assembly processes to meet manufacturing and quality requirements.
- Support product development, new product/package/technology transfer, qualification, production setup, validation, and ramp-up.
- Collaborate with Central Engineering (CE), Process Engineering, and manufacturing teams to improve production volume, yield, cost, stability, and quality.
- Conduct risk assessments, define mitigation plans, select BOM, and establish process flows.
- Perform technical gap analysis and Design for Manufacturability (DFM) to ensure cost competitiveness.
- Troubleshoot qualification and process issues, conduct investigations, and identify root causes.
- Select suitable materials, equipment, and manufacturing peripherals to meet quality, reliability, cost, yield, and production targets.
- Lead continuous improvement projects using tools such as DOE, SIPOC, and Lean Six Sigma.
- Support the transition of engineering builds and new products into mass production.
- Perform other duties as assigned by management.
Yêu cầu
- Bachelor's or Master's degree in Electrical, Mechanical, Materials Engineering, Chemistry, Physics, or a related field.
- At least 5 years of experience in semiconductor packaging and manufacturing.
- Hands-on experience in assembly processes such as plasma cleaning, coating, molding, plating, chemical deflash, trim, and form.
- Knowledge of epoxy molding compounds, plating chemistry, lead frames, substrates, and direct-bonded copper (DBC) ceramics.
- Proficiency in engineering tools such as AutoCAD, 8D, SPC, DFMEA, and DOE.
- Experience leading cross-functional projects in a fast-paced environment.
- Ability to work independently and collaboratively.
- Experience in power module packaging, reliability, and chip package interaction (CPI) is preferred.
- Semiconductor wafer processing experience, particularly silicon or silicon carbide (SiC), is an advantage.
- Experience in data analysis using JMP, Minitab, or Power BI is preferred.
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