Việc làm Khác Đã xuất bản

New Product Introduction

Tên công ty: onsemi Hình thức làm việc: Toàn thời gian
Thẻ
Semiconductor Fulltime Manufacturing Semiconductor Industry Khác
Loại hình
Tại văn phòng
Mức lương
Lương thỏa thuận
Hạn tuyển
13/11/2026
Nội dung
  • Develop and maintain assembly processes to meet manufacturing and quality requirements.
  • Support product development, new product/package/technology transfer, qualification, production setup, validation, and ramp-up.
  • Collaborate with Central Engineering (CE), Process Engineering, and manufacturing teams to improve production volume, yield, cost, stability, and quality.
  • Conduct risk assessments, define mitigation plans, select BOM, and establish process flows.
  • Perform technical gap analysis and Design for Manufacturability (DFM) to ensure cost competitiveness.
  • Troubleshoot qualification and process issues, conduct investigations, and identify root causes.
  • Select suitable materials, equipment, and manufacturing peripherals to meet quality, reliability, cost, yield, and production targets.
  • Lead continuous improvement projects using tools such as DOE, SIPOC, and Lean Six Sigma.
  • Support the transition of engineering builds and new products into mass production.
  • Perform other duties as assigned by management.
Yêu cầu
  • Bachelor's or Master's degree in Electrical, Mechanical, Materials Engineering, Chemistry, Physics, or a related field.
  • At least 5 years of experience in semiconductor packaging and manufacturing.
  • Hands-on experience in assembly processes such as plasma cleaning, coating, molding, plating, chemical deflash, trim, and form.
  • Knowledge of epoxy molding compounds, plating chemistry, lead frames, substrates, and direct-bonded copper (DBC) ceramics.
  • Proficiency in engineering tools such as AutoCAD, 8D, SPC, DFMEA, and DOE.
  • Experience leading cross-functional projects in a fast-paced environment.
  • Ability to work independently and collaboratively.
  • Experience in power module packaging, reliability, and chip package interaction (CPI) is preferred.
  • Semiconductor wafer processing experience, particularly silicon or silicon carbide (SiC), is an advantage.
  • Experience in data analysis using JMP, Minitab, or Power BI is preferred.