Việc làm Khác Đã xuất bản

Senior NPI Engineer

Tên công ty: onsemi Hình thức làm việc: Toàn thời gian

Thẻ

Semiconductor Fulltime Manufacturing Semiconductor Industry Khác

Loại hình

Tại văn phòng

Mức lương

Lương thỏa thuận

Hạn tuyển

13/11/2026

Nội dung

Develop and maintain assembly processes to meet manufacturing and quality requirements.
Provide engineering support throughout the product development process.
Lead the transfer, qualification, production setup, validation, and ramp-up of new products, packages, and technologies.
Collaborate with central engineering (CE), process engineering, and manufacturing teams to integrate new technologies into production and improve volume, yield, cost, stability, and quality.
Define risk assessment and mitigation plans, select the Bill of Materials (BOM), and establish process flows.
Conduct technical gap analysis and apply Design for Manufacturability (DFM) principles to improve cost competitiveness.
Troubleshoot issues, investigate qualification failures, and perform root cause analysis.
Select materials, equipment, and manufacturing peripherals to meet quality, reliability, cost, yield, and production targets.
Lead improvement projects and collaborate with unit process teams to enhance process stability, yield, cost, and quality.
Transfer new products from engineering builds to mass production using methodologies such as Design of Experiments (DOE), SIPOC, and Lean Six Sigma.
Perform other duties as assigned.

Yêu cầu

Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, Science and Technology, Chemistry, Physics, or a related field.
At least 5 years of experience in semiconductor packaging and manufacturing.
Hands-on experience with assembly processes, including plasma cleaning, coating, molding, plating, chemical deflash, trim, and form.
Knowledge of thermosetting plastics, epoxy molding compounds, plating chemistry, chemical deflash, lead frames, substrates, and Direct Bonded Copper (DBC) ceramics.
Proficiency in engineering tools such as AutoCAD, 8D, SPC, DFMEA, and DOE.
Proven ability to lead cross-functional projects in a fast-paced, multicultural environment.
Strong teamwork skills and the ability to work independently.
Experience in power module packaging, reliability engineering, and Chip-Package Interaction (CPI) is preferred.
Experience in semiconductor manufacturing or silicon/silicon carbide (Si/SiC) wafer processing is an advantage.
Experience in data analysis using tools such as JMP, Minitab, or Power BI is preferred.

Việc làm liên quan